Quote:
Originally Posted by andy
BGA soldering has to be the worst thing to happen to electronics reliability and repairability. At best, it's extremely susceptible to damage from flexing, and thermal cycling, and things are even worse with the move toward higher ball densities, lead free solder, and hotter running chips. I've had some luck reflowing older, larger ball BGA chips with lead solder, but the newer, smaller ones are almost impossible. If they couldn't get a lasting connection in the factory under ideal conditions with fresh parts, then a reflow is unlikely to last. Chronic failure means that the design simply puts too much stress on the solder balls.
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I think of BGA rework as sort of a "black art" and i've been doing it for 16yrs. now for both commercial and military customers alike
I'm still surprised even to this day i haven't gone insane yet!
